Camera Module and Manufacturing Method Thereof

ABSTRACT

A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.

CROSS REFERENCE OF RELATED APPLICATION

This application is a Continuation application that claims the benefitof priority under 35 U.S.C. § 120 to a non-provisional application,application Ser. No. 16/547,537, filed Aug. 21, 2019, which is anon-provisional application that claims the benefit of priority under 35U.S.C. § 119 to Chinese application number 2018109527704, filed Aug. 21,2018, Chinese application number 2018213515512, filed Aug. 21, 2018,Chinese application number 2019104389172, filed May 24, 2019, Chineseapplication number 2019207651660, filed May 24, 2019, Chineseapplication number 2019104392851, filed May 24, 2019, Chineseapplication number 2019207646893, filed May 24, 2019, Chineseapplication number 2019104388856, filed May 24, 2019, and Chineseapplication number 2019207664410, filed May 24, 2019, which areincorporated herewith by references in their entirety.

BACKGROUND OF THE PRESENT INVENTION Field of Invention

The present invention relates to optical sensor, and more particularlyto a camera module and manufacturing method thereof.

Description of Related Arts

A highly qualified camera is necessary to be installed in a smart devicethese days. For example, a smart phone is sensing the world by at leastone or two cameras for acquiring images. In pursing the thinner smartdevice, the smaller camera become more completive in marketing sales.

During the arranging processes of conventional camera module, a chip anda plurality of electronic elements are attached on a circuit boardfirstly, and a holder is formed on the circuit board by attaching ormolding, and normally a filter assembly is attached on the holder. Thenthe optical lens is attached on the filter assembly to remain theoptical lens on the light sensitive passage of the chip.

The thickness of the camera module mainly decided by the thickness ofthe circuit broad, the height of the holder, the thickness of the filterassembly and the height of the optical lens, in this arrangingprocesses. In other words, with the conventional design structure, theheight of the camera module is equally same as the sum of the thicknessof the circuit broad, the height of the holder, the thickness of thefilter assembly and the height of the optical lens, which is highlylimitation of development of smaller camera module.

There is an avoiding space remained between the holder and theelectronic elements in the conventional camera module. And the filterassembly is mounted on the arms of the holder. The arms mounted with thefilter assembly has a minimum thickness, above 0.2 mm. Furthermore, asafety distance between the top surface of the filter assembly and thebottom surface of the optical lens is remained, so that the stackingaccumulation in height in conventional camera module causes thedifficulty to reduce the height of the holder.

A conventional camera module in a smart phone is disclosed in FIG. 1. Afilter assembly 20P is supported by a sensor assembly 30P thereon. Andan optical assembly 10P is mounted on the top of the filter assembly 20Pfor transmitting shaped and filtered light into a sensor 300P of thesensor assembly 30P. For better quality, the filter assembly 20P isrequired to be placed between the optical assembly 10P and the sensor300P. So the thickness of the conventional camera module is decided fromthe sensor assembly 30P to the optical assembly 10P. And the size of theconventional camera module is hardly to be reduced since there is theheight of the optical assembly 10P, the thickness of the filter assembly20P and the height of the sensor assembly 30P. The conventional cameramodule with such a size is not suitable and not beautiful for a thin andfashion smart phone. In this embodiment of the conventional cameramodule, the filter assembly 20P comprises a filter element 21P and afilter supporter 22P surrounded and supported the filter element 21Pbetween the optical assembly 10P and the sensor assembly 30P. The heightof the optical assembly 10P and the thickness of the sensor assembly 30Pare really hard to reduce because of the complicated optical design ofthe optical assembly 10P and the size of the electronic componentsinside the sensor assembly 30P. Especially, the rear focal distance ofthe camera module is requited to be less than 0.6 mm, which isimpossible to achieve with conventional process.

Some kinds of the conventional camera module are trying to mount thefilter element 21P under the optical assembly 10P directly without thefilter supporter 22P to reduce the thickness of the camera module, butthe optical assembly 10P is stressed on the filter element 21P directlyand the filter element 21P can hardly bare the weight or the movement ofthe optical assembly 10P when activated in using. Also the glue ofmounting the optical assembly 10P is easy to flow into the center of thefilter element 21P to cover the transmitting area thereof. These kindsof broken filter elements 21P will cause the whole camera module toodifficult to acquire images.

Other kinds of the conventional camera module are trying to attach thefilter element 21P on the surface of the sensor 300P or the bottomsurface of the lenses of the optical assembly 10P. But it requires moredetails to attach the filter element 21P on the surface to be like afilm on a glass. For example, the flatness between the filter element21P and the sensor 300P is very hard to ensure and both of thedurability of the filter element 21P and the sensor 300P will beadversely effected. Once there is bubbles or wrinkles, the filteringeffect of the filter element 21P is reduced and may fail to work so thatthe quality and reliability of the camera module are reduced.

In fact, the distances between the optical assembly 10P and the filterelement 21P and between the filter element 21P and the sensor 300P areessential for the quality of imaging. After reflected by the filterelement 21P, stray light goes into the sensor 300P. If the distancebetween the filter element 21P and the sensor 300P is too short, straylight goes into the center of the sensor 300P which is the sensing areafor imaging. If the distance between the filter element 21P and thesensor 300P is a little further, stray light goes into the periphery ofthe sensor 300P which is easy to be ignored during calculating. So maybeattaching the filter element 21P on the surface of the sensor 300P orthe bottom surface of the lenses of the optical assembly 10P can reducethe thickness of the camera module, but the validity of acquiring imageshas to be reduced, which means the filter element 21P did not achievethe best effect, which is not good enough for smart devices.

SUMMARY OF THE PRESENT INVENTION

The invention is advantageous in that it provides a camera module andmanufacturing method thereof, wherein the thickness of the camera moduleis mainly depended on the height of an optical lens and the thickness ofa molded photosensitive assembly to save installation space in a smartdevice.

Another advantage of the invention is to provide a camera module andmanufacturing method thereof, wherein the difficulty and complexity ofmanufacturing the optical lens and the molded photosensitive assemblyare not increased for efficiently producing the small-sized cameramodule.

Another advantage of the invention is to provide a camera module andmanufacturing method thereof, wherein the filter is well supported andhas no needs to support the optical lens, so that the optical lens issupported stably without considering about damaging the filter.

Another advantage of the invention is to provide a camera module andmanufacturing method thereof, wherein a lens glue adhered between theoptical lens and the molded photosensitive assembly is away from thefilter to keep the transmitting area of the filter to be uncovered.

Another advantage of the invention is to provide a camera module andmanufacturing method thereof, wherein the distance between the filterand the optical lens is ensured to have less stray light into aphotosensitive chip molded in the molded photosensitive assembly inorder to enhance imaging quality.

Another advantage of the invention is to provide a camera module andmanufacturing method thereof, wherein the distance between the filterand the photosensitive chip is ensured to have less stray light into thecenter of the photosensitive chip in order to increase imaging quality.

Another advantage of the invention is to provide a camera module andmanufacturing method thereof, wherein the photosensitive chip can hardlybe stressed by the filter and be capable of having better sensingability.

Another advantage of the invention is to provide a camera module andmanufacturing method thereof, wherein the optical lens is directlysupported by the molded photosensitive assembly so that the optical lenshas a strong support.

Another advantage of the invention is to provide a camera module andmanufacturing method thereof, wherein the molded photosensitive assemblyprovide a higher support for the optical lens and a lower support forthe filter so that the optical lens and the filter are stably supportedwhile the interfere between the optical lens and the filter is avoidedeffectively.

Another advantage of the invention is to provide a camera module andmanufacturing method thereof, wherein the optical lens is capable ofmounting on the molded photosensitive assembly to fit the peripheralshape of the smart device so that the imaging ability is ensured withbetter looking appearance.

Additional advantages and features of the invention will become apparentfrom the description which follows, and may be realized by means of theinstrumentalities and combinations particular point out in the appendedclaims.

According to the present invention, the foregoing and other objects andadvantages are attained by a camera module comprising:

an optical lens;

a filter; and

a molded photosensitive assembly adhered with the optical lens and thefilter, wherein the molded photosensitive assembly comprises a mainbody, a plurality of electronic components, a photosensitive chip, and acircuit board connected with the electronic components and thephotosensitive chip, wherein the electronic components, thephotosensitive chip and the circuit board are positionally fixed witheach other surrounded by the main body, wherein the main body comprisesa container body supporting the optical lens thereon and a lower bodysupporting the filter thereon, wherein the photosensitive chip issurrounded by a bottom of the main body to keep a distance away from thefilter.

Still further objects and advantages will become apparent from aconsideration of the ensuing description and drawings.

These and other objectives, features, and advantages of the presentinvention will become apparent from the following detailed description,the accompanying drawings, and the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view of a conventional camera module in a smartdevice.

FIG. 2 is a sectional view of a camera module according to a firstpreferred embodiment of the present invention.

FIG. 3 is a perspective view of the filter and the molded photosensitiveassembly of the camera module according to the above preferredembodiment of the present invention.

FIG. 4 is a top view of the filter and the molded photosensitiveassembly of the camera module according to the above preferredembodiment of the present invention.

FIG. 5 is a sectional view of the filter and the molded photosensitiveassembly of the camera module according to the above preferredembodiment of the present invention.

FIG. 6 is a sectional view of the camera module according to the abovepreferred embodiment of the present invention, illustrating analternative installing mode in a smart phone.

FIGS. 7A and 7B are flow diagrams of a manufacturing method of thecamera module according to the above preferred embodiment of the presentinvention.

FIG. 8 is a flow diagram of a manufacturing method of the camera moduleaccording to the above preferred embodiment of the present invention.

FIG. 9 is a sectional view of the filter and the molded photosensitiveassembly of the camera module according to an alternative mode of theabove preferred embodiment of the present invention.

FIG. 10 is a sectional view of the filter and the molded photosensitiveassembly of the camera module according to an alternative mode of theabove preferred embodiment of the present invention.

FIG. 11 is a sectional view of the filter and the molded photosensitiveassembly of the camera module according to an alternative mode of theabove preferred embodiment of the present invention.

FIG. 12 is a sectional view of a camera module according to a secondpreferred embodiment of the present invention.

FIG. 13 is a perspective view of the camera module according to theabove preferred embodiment of the present invention.

FIG. 14 is a top view of the filter and the molded photosensitiveassembly of the camera module according to the above preferredembodiment of the present invention.

FIG. 15 is a sectional view of the camera module according to the abovepreferred embodiment of the present invention, illustrating analternative installing mode in a smart phone.

FIG. 16 is a sectional view of a camera module according to a thirdpreferred embodiment of the present invention.

FIG. 17 is an exploded view of the camera module according to the abovepreferred embodiment of the present invention.

FIG. 18 is a top view of the filter and the molded photosensitiveassembly of the camera module according to the above preferredembodiment of the present invention.

FIG. 19 is a perspective view of the camera module according to analternative mode of the above preferred embodiment of the presentinvention.

FIG. 20 is a top view of the filter and the molded photosensitiveassembly of the camera module according to the above alternative mode ofabove preferred embodiment of the present invention.

FIGS. 21A and 21C are flow diagrams of a manufacturing method of thecamera module according to the above preferred embodiment of the presentinvention.

FIG. 22 and FIG. 23 are schematic views illustrating the otheralternative mode of the above preferred embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The following description is disclosed to enable any person skilled inthe art to make and use the present invention. Preferred embodiments areprovided in the following description only as examples and modificationswill be apparent to those skilled in the art. The general principlesdefined in the following description would be applied to otherembodiments, alternatives, modifications, equivalents, and applicationswithout departing from the spirit and scope of the present invention.

The present invention provides a camera module, as shown in FIG. 2 toFIG. 21, which is small sized and adapted to be installed in a smartdevice for acquitting images. The first embodiments of the presentinvention of the camera module is illustrated in FIGS. 2-11, whichcomprises an optical assembly 10, a filter 20 and a moldedphotosensitive assembly 30. The thickness of the camera module isdecided by the height of the optical assembly 10 and the thickness ofthe molded photosensitive assembly 30. The molded photosensitiveassembly 30 is capable of receiving imaging lights transmitted from theoptical assembly 10 to the filter 20. After the imaging lights areshaped by the optical assembly 10 and filtered by the filter 20, aphotosensitive chip 33 molded in the molded photosensitive assembly 30has high quality resource to image. The optical assembly 10 can beimplemented as optical lens, motor lens, etc.

The filter 20 is mounted on the molded photosensitive assembly 30 at alower place than where the optical assembly 10 is mounted on the moldedphotosensitive assembly 30, as shown in FIGS. 2-4, so that the distancesbetween the filter 20 and the molded photosensitive assembly 30 andbetween the filter 20 and the optical assembly 10 are maintained to haveless stray lights transmitted into the center of the moldedphotosensitive assembly 30. In this embodiments, the filter 20 is fixedon the molded photosensitive assembly 30 with a filter glue 220. And theoptical assembly 10 is fixed on the molded photosensitive assembly 30with a lens glue 110. It is worth to mention that the filter glue 220and the lens glue 110 are at different levels on the moldedphotosensitive assembly 30 so that the lens glue 110 is kept a distanceaway from the filter glue 220 to have no chance to cover the filter 20.

Furthermore, in the embodiment, the photosensitive chip 33 is preferablyfixed at the bottom of the molded photosensitive assembly 30. Theoptical assembly 10 is adhered on the top of the molded photosensitiveassembly 30. And with the filter 20 is adhered between the opticalassembly 10 and the photosensitive chip 33, the molded photosensitiveassembly 30 is supporting the optical assembly 10 and the filter 20 withstable supporting force.

The optical assembly 10 comprises a lens-barrel 11 and a plurality oflenses 12 mounted therein. And the lens-barrel 11 comprises a leg 111supported the lenses 12 away from the filter 20. The leg 111 of the lensbarrel 11 is fixed on the molded photosensitive assembly 30 to supportthe lenses 12 in distance from the filter 20 and the photosensitive chip33 to have imaging lights transmitted in required quality.

The filter 20 comprises a filtering portion 21 transmitted imaging lightand a peripheral portion 22 extended from the filtering portion 21 andsupported on the molded photosensitive assembly 30 so as to align thefiltering portion 21 with the photosensitive chip 33. It is worth tomention that the filter glue 220 is between the peripheral portion 22and the photosensitive assembly 30 which is not covering the filteringportion 21 and the photosensitive chip 33 of the molded photosensitiveassembly 30. And the peripheral portion 22 of the filter 20 is directlysupported on the molded photosensitive assembly 30 without any externalsupporting device. Especially, in one embodiment of the presentinvention, the peripheral portion 22 is integrally extended from thefiltering portion 21, and the peripheral portion 22 is positioned tosurround the filtering portion 21, so that the filter 20 is a one-pieceelement for easily being fixed in the supporting cavity 300 of themolded photosensitive assembly 30.

Especially, the molded photosensitive assembly 30 further comprises amain body 31, a plurality of electronic components 32 and a circuitboard 35. The photosensitive chip 33 is electrically connected with theelectronic components 32 through the circuit board 35. The main body 31is embedding the electronic components 32 on the circuit board and formsthe supporting cavity 300 to hold the filter 20 and the optical assembly10 with a distance therebetween. In other words, the main body 31 coverspart of the electronic components 32 and the circuit board 35, whereinthe photosensitive chip 33 is surrounded by the bottom of the main body31 and kept a distance with the filter 20.

In this embodiment, the photosensitive chip 33 is connected to thecircuit board 35 with a set of wires 34. One end of the wire 34 is fixedon the circuit board 35, while the other end of the wire 34 is fixed onthe photosensitive chip 33. One skilled in the art will understand thatthe photosensitive chip 33 is transferred light into images withconnected electronic components 32 on the circuit board 35. The mainbody 31 is partly covered on the photosensitive chip 33 to fixedphotosensitive chip 33 and the wires 34 on the circuit board 35 insidethe main body 31. In other words, the wires 34 and the periphery of thephotosensitive chip 33 are fully covered inside the main body 31 of themolded photosensitive assembly 30 to be protected. And thephotosensitive chip 33 is surrounded with the electronic components 32,as shown in FIGS. 2-5, and the periphery of the main body 31 embeddedwith the electronic components 32 is higher than the inner portion ofthe main body 31 which is embedded with the wires 34.

Furthermore, the top of the periphery of the main body 31 is supportingthe optical assembly 10 which is away from the filter 20 and thephotosensitive chip 33 so that the filter 20 and photosensitive chip 33are not under the stress of the optical assembly 10. Preferably, notonly the places of the electronic components 32, the photosensitive chip33 and the filter 20 are settled by the main body 31, the size of themain body 10 and the distance between the main body 10 and the filter 20are designed accordingly for enhancing compactness, stability andreliably of the camera module and the detail numbers are disclosed inthe following paragraphs. It is worth to mention that the drawings onlyillustrate positional relationships of the optical assembly 10, thefilter 20 and the molded photosensitive assembly 30 without exact sizeproportion.

Furthermore, as shown in FIGS. 4-5, the filtering portion 21 has anin-light surface 211 and an out-light surface 212, wherein the in-lightsurface 211 is facing to the lenses 12 of the optical assembly 10 andthe out-light surface 212 is facing to the photosensitive chip 33. Afterthe imaging light is shaped by the lenses 12 of the optical assembly 10,the imaging light is passing through the in-light surface 211 firstlyand the out-light surface 212 secondly so as to be filtered. Preferably,the filtering portion 21 is made of infrared-ray filtered material. Theperipheral portion 22 has a peripheral top surface 221, a peripheralside surface 222 and a peripheral bottom surface 223. In thisembodiment, the peripheral top surface 221 is a same surface with thein-light surface 211 and the peripheral bottom surface 223 is a samesurface with the out light surface 222.

It is worth to mention that the peripheral bottom surface 223 of theperipheral portion 22 of the filter 20 is adhered by the filter glue 220to the main body 31 of the molded photosensitive assembly 30, so thatthe filtering portion 21 is clear to be transmitted the imaging light.And the filtering portion 21 and the peripheral portion 22 have no needsto support anything on the in-light surface 211 or the peripheral topsurface 221, which provides more reliability for the filter 20.

Particularly, the main body 31 of the molded photosensitive assembly 30comprises a container body 311 and a lower body 312 integrally extendedfrom inner side of the container body 311. Both of the container body311 and the lower body 312 are formed and molded on a connecting surface350 of the circuit board 35 to cover the electronic components 32, thewires 34 and the photosensitive chip 33. In the first embodiment, theelectronic components 32 are mainly embedded inside the container body311, and the wires 34 and the photosensitive chip 33 are mainly embeddedinside the lower body 312. In other embodiments, the electroniccomponents 32 can be embedded under the lower body 312.

Especially, the container body 311 has a certain distance in highestwith the lower body 312 to form a square slot inside the main body 31,so that the filter 20 is provided inside the square slot of the mainbody 31. In other words, the container body 311 has a higher top surface3111 and a higher side surface 3112, wherein the higher top surface 3111of the container body 311 is supporting the optical assembly 10 thereon.The lower body 312 has a lower top surface 3121 and a lower side surface3122, wherein lower top surface 3121 of the lower body 312 is supportingthe filter 20 thereon, wherein the higher side surface 3112 of thecontainer body 311 and the lower side surface 3122 of the lower body 312forms the supporting cavity 300 of the molded photosensitive assembly 30inwardly. The distance between the higher top surface 3111 of thecontainer body 311 and the connecting surface 350 of the circuit board35 is larger than the distance between the lower top surface 3121 of thelower body 312 and the connecting surface 350 of the circuit board 35.In other words, the higher side surface 3112 and the lower top surface3121 are shaped groovedly to receive the filter 20 therein withoutprotruding the filter 20 above the higher top surface 3111. It isappreciated that the container body 311 has a higher outer surface 3113,so as to form the outer surrounding surface of the main body 31.

In this embodiment, as shown in FIG. 5, the height J between thecontainer body 311 and the lower body 312 is larger than 0.1 mm. Inother words, the distance between the higher top surface 3111 and thelower top surface 3121 is greater than 0.1 mm to fit the thickness ofthe filter 20 and the filter glue 220. Preferably, the height J betweenthe container body 311 and the lower body 312 is greater or equal to thesum of the thickness of the filter 20, the filter 220 and wealth of 0.04mm (such as 0.28 mm), so that the thickness of the filter 20 is hiddeninside the main body 31 of the molded photosensitive assembly 30.

And the thickness H of the filter glue 220, which has to be considered,is less than 0.03 mm. The thickness of the filter glue 220 is adapted tobe reduced with the adhesion strong enough while using a thermosettingglue in this embodiment.

It is worth to mention that the length C of lower top surface 3121 ofthe lower body 312, which is from the higher side surface 3112 to lowerside surface 3122, or can be named as the thickness of the lower body312, is equal or greater than 0.4 mm, so that with ensuring thecontainer body 311 and the lower body 312 can be L-shaped slotedly, thelength C ensures enough mounting area on the lower top surface 3121 ofthe lower body 312 for the filter 20, which is adapted to allowdeviation of mounting the filter 20 to avoid adverse affect. There isenough area on the lower top surface 3121 for the filter glue 220 todraw, which increases the contact area of the filter 20 and the filterglue 220 to improve adhesion of glue.

The filter glue 220 is applied between the peripheral bottom surface 223of the peripheral portion 22 of the filter 20 and the lower top surface3121 of the lower body 312 to connect the peripheral portion 22 of thefilter 20 with the lower body 312 via the filter glue 220. The filterglue 220 is applied in an approximate square shape which is smaller thanan approximate square shape of the lens glue 110.

Preferably, the width of the filter glue 220, between the peripheralbottom surface 223 and the lower top surface 3121 of the lower body 312,has maximum which equally to the width B of the peripheral portion 22which is equal or greater than 0.25 mm, so that the filter 20 is stablysupported on the peripheral portion 22 to ensure enough mounting area onthe lower top surface 3121 of the lower body 312 for the filter 20,which is adapted to allow deviation of mounting the filter 20 to avoidadverse effect with the filtering portion 21 aligned to thephotosensitive chip 33.

Furthermore, there is a gap between the side of the filter 20 to theinner side of the container body 311 of the main body 31. In otherwords, the filter 20 is not touching the main body 31 to reducevibration transferred by the main body 31 from the optical assembly 10.Also the lens glue 110 is away from the in-light surface 211 of thefiltering portion 21 because of the gap between the side of the filter20 to the inner side of container body 311 of the main body 31 canreceive the extra lens glue 110 inside, which can effectively preventthe lens glue 110 from flowing on in-light surface 211 of the filteringportion 21. Preferably, the distance A between the peripheral sidesurface 222 of the peripheral portion 22 of the filter 20 and the higherside surface 3112 of the container body 311 is equal or greater than0.15 mm, which is beneficial to be aside between the filter 20 and thecontainer body 311, like leaving a space.

It is worth to mention that the lens glue 110 is connected the leg 111of the lens-barrel 11 and the higher top surface 3111 of the containerbody 311 of the main body 31 to support the optical assembly 10 mainlyon the container body 311 to reduce stress on the photosensitive chip33. Preferably, the height K of the container body 311 is equal orgreater than 0.5 mm, so that the container body 311 covering theelectronic components 32 can be effectively molded, and also theelectronic components 32 can be protected from being over stressed bythe leg 111 of the optical assembly 10. And since the filter 20 issupported on the lower body 312, the filter 20 has no needs to affordthe weight and movement of the optical assembly 10 to enhancereliability. Especially, the lens-barrel 11 is directly on the main body31, so that the thickness of the camera module is decided by the heightof the optical assembly 10 and the thickness of the moldedphotosensitive assembly 30 to reduce the thickness of the whole cameramodule.

It is worth to mention that, the capacitors of the electronic components32 normally have biggest size. Therefore, the distance D between thecapacitor of the electronic components 32 and the peripheral sidesurface 222 of the peripheral portion 22 of the filter 20 is preferablyequal or greater than 0.2 mm, for avoiding the interference between themanufacturing mold and the electronic components 32 and having enoughspace to optimize structure between the electronic components 32 and thefilter 20, which benefits forming complicate mold structure therebetweento increase function of mold structure. Preferably, the distance Dbetween each of the electronic components 32 and the peripheral sidesurface 222 of the peripheral portion 22 of the filter 20 is equal orgreater than 0.25 mm.

According to the embodiment, the container body 311 and the lower body312 are also shaped as an approximated square with rounded corners whichthe in radius F of the inscribed circle of the rounded corners are isequal or greater than 0.3 mm. It is worth to mention that the roundedcorners of the container body 311 and the lower body 312 needs to beaside with the filter 20, like leaving a space, to reduce opportunitiesof interference between the rounded corners of the container body 311and the lower body 312. Of course, in other embodiments of the presentinvention, the rounded corners of the container body 311 and the lowerbody 312 can be designed as the rounded corners of the filter 20.

With the photosensitive chip 33 fixed at the bottom of the lower body312 of the main body 31, the filter 20 is kept distance with thephotosensitive chip 33 by the lower body 312. Preferably, the distance Ibetween the lower top surface 3121 of the lower body 312 and thephotosensitive chip 33 is preferred to be equal or greater than 0.15 mm,which ensures the mold structure is thick enough to block stray lightreflected from the optical lens, the filter and other structure toreduce useless light and improve the quality of imaging, also can avoidthe photosensitive chip 33 from being stressed or broken. Meanwhile, thedistance I is equal or greater than 0.15 mm to avoid interferencebetween the manufacturing mold and the wires 34 and prevent exposing thewires 34. It is appreciated that if the rear focal length meetsrequirement, the distance I can be as large as possible to avoid blackpoint formed by the dirt of the filter 20. Especially, if the distance Ibetween the lower top surface 3121 of the lower body 312 and thephotosensitive chip 33 is larger than 0.25 mm. And the capacitor can beplaced under the lower body 312 to reduce the size in XY direction ofthe camera module.

Thus, in this embodiment, the main body 31 is not only covering theelectronic components 32 and the wires 34 to protect, but also providethe supporting cavity 300 to hold the optical assembly 10 and the filter20 respectively without over stressed on the electronic components 32 orthe photosensitive chip 33.

It is worth to mention that, on the one hand, in order to improve screenratio of mobile phone (e.g. smart phone), the fitness between the sidesurface of the camera module and the side surface of the smart phone ismore and more highly required, that is user want the camera module closeto the casing of the smart phone. On the other hand, in other to havegood touching and holding feelings, the casing of the smart phone has anarc-shaped curve (e.g. curved frame). The side walls of the module ofthe camera module are generally flush, which causes the flush sidewallsof the camera module to not fit well with the curved outer frame of thesmart phone, so that there is a large gap between them, which greatlylimits the fitness of the camera module to the smart phone. It can beunderstood that although the camera module of the present invention canreduce the height of the camera module by reducing the height of thecontainer body 311, it is limited by the height of the electroniccomponent 32 itself. The degree of reduction of the height of thecontainer 311 is limited. Therefore, the fitness between the cameramodule and the smart phone of the above embodiment of the presentinvention is still not good enough.

In order to solve above mentioned problems, as shown in FIG. 6, thepresent invention further provides a modified embodiment of the cameramodule according to the above embodiment of the present invention,wherein the optical assembly 10 of the camera module is eccentricallydisposed on the molded photosensitive assembly 30, to enable the opticalassembly 10 to be further adjacent to a mounting casing 51. That is,when the camera module is fixed to the mounting casing 51, the opticalassembly 10 can be biased toward the mounting casing 51 by an eccentricarrangement, so that the optical assembly 10 can be further close to themounting casing. 51, which helps to further improve the degree offitness between the camera module and the mounting casing 51.

In other words, the optical assembly 10 can be slightly bias placed withthe molded photosensitive assembly 30 to adapt the mounting casing 51 ofthe smart phone. And the optical assembly 10 is capable of beingslightly non-aligned with the molded photosensitive assembly 30 to fitthe case of the smart device, as shown in FIG. 6. In other words, theleg 111 of the lens-barrel 11 is slightly protruded from the higher topsurface 3111 of the container body 311, which has no effect on thestability of the filter 20.

It is worth to mention that when the camera module is mounted on the topside of the mounting casing 51 of the smart device, the leg 111 of thelens-barrel 11 only needs to have a side slightly protruding from thehigher top surface 3111 of the container body 311. And when the cameramodule is mounted on a corner of the mounting casing 51 of the smartdevice, the legs 111 of the lens-barrel 11 need to have adjacent sidesprotruded outwardly from the top surface 3111 of the container body 311,so that the camera module is in contact with the corner of the mountingcasing 51 of the device.

A manufacturing method of the camera module is illustrated in FIGS.7A-8. The method, as shown in FIG. 7A, comprises steps of:

I. connecting the photosensitive chip 33 with the wires 34 and theelectronic components 32 on the circuit board 35;

II. placing the connected circuit board 35 between an upper mould 41 anda lower mould 42; and

III. embedding the electronic components 32 on the circuit board 35 bythe main body 31 which comprises the container body 311 and the lowerbody 312 to form the molded photosensitive assembly 30.

Furthermore, as shown in FIG. 7B, the method further comprises steps of:

IV. mounting the filter 20 on the lower top surface 3121 of the lowerbody 312; and

V. mounting the optical assembly 10 on the higher top surface 3111 ofthe container body 311.

Furthermore, in the step III, the lower top surface of the lower body islower the higher top surface of the container body, and the lower topsurface of the lower body is lower than the highest component of theelectronic components 32.

In one embodiment, the electronic components 32, the wires 34 and theperiphery of the photosensitive chip 33 is embedded in the main body 31.

Illustratively, as shown in FIG. 19A, the step III further comprises thesteps of:

III.1. injecting molding material between the upper mould 41 and thelower mould 42;

III.2. solidifying molding material to form the main body 31; and

III.3. demolding the upper mould 41 and the lower mould 42 from themolded photosensitive assembly 30.

It is worth to mention that, as shown in FIG. 19A, the angle G betweenthe higher side surface 3112 of the container body 311 and the lower topsurface 3121 of the lower body 312 is preferably equal to or greaterthan 95°, for easily drafting operation. More preferably, the angle Gbetween the higher side surface 3112 and the lower top surface 3121 isalso less than 100° so as to be able to block certain stray light whileensuring smooth molding of the molded structure. Furthermore, in orderto ensure normal molding processing, the fillet radius between thehigher side surface 3112 and the lower top surface 3121 is substantiallyequal to 0.1 mm. In other words, since the angle between the higher sidesurface 3112 of the container body 311 and the normal line of the lowertop surface 3121 can be referred to as the draft angle of the higherside surface 3112, the inclusion body 311 The draft angle of the higherside surface 3112 is between 5° and 10°.

It is worth to mention that the draft angle of the higher side surface3112 of the lower body 312 is preferably implemented between 5° and 10°.In particular, the draft angle of the outer side surface of thecontainer body 311 (ie, the outer side surface of the main body 31) isalso implemented to be between 5° and 10°, which facilitates thesuccessful completion of the drafting operation after molding.

The step IV, as shown in FIG. 20, further comprises the steps of:

IV.1. applying the filter glue 220 in a C-shape on the lower top surface3121, so that a gap between two ends of the filter glue 220 is formed;

IV.2. mounting the filter 20 on the filter glue 220;

IV.3. solidifying the C-shape filter glue 220; and

IV.4. filling the filter glue 220 into the gap of the C-shape to formthe filter glue 220 in an approximate square shape.

Furthermore, as shown in FIG. 20, in step IV.3, the extra air betweenthe filter 20 and the photosensitive chip 33 is discharged through thegap to ensure the pressure between the optical assembly 10 and thephotosensitive chip 33 equal to Atmospheric pressure. Preferably, thedistance E of the gap is between 0.7 and 1.0 mm (greater than or equalto 0.7 mm and less than or equal to 1.0 mm) to remain a certain gapafter the filter 20 attached and pressing on the filter glue 220 to forman escape hole, so that the extra air is discharged from the hole.

It is worth to mention that the upper mould 41 is shaped similar as thesupporting cavity 300, so that after demolding the upper mould 41, thesupporting cavity 300 is formed between the main body 31 and thephotosensitive chip 33.

An alternative mode of the embodiment is illustrated as in FIG. 9,wherein the molded photosensitive assembly 30 further comprises a topcover 36. The top cover 36 is mounted on the higher top surface 3111 ofthe container body 311, and extended to cover the peripheral portion 22of the filter 20, so that the filter 20 is hold from bottom to top toenhance the stability of the filter 20. It is worth to mention that thethickness of the top cover 36 is less than the thickness of the filter20 to reduce the thickness of the whole camera module.

The other alternative mode of the embodiment is illustrated as in FIG.10, which is different from the first embodiment that the lower body 312is not covering the wires 34 of the molded photosensitive assembly 30.And the thickness of the camera module in this mode is lower than thefirst embodiment. Because only the lower body 312 is required to behigher than the wires 34 rather than fully covering the wires 34, so thelower body 312 is lower. With lower the lower body 312, the containerbody 311 can be lower to fit the thickness of the filter 20.

The other alternative mode of the embodiment is illustrated as in FIG.11, which is different from the first embodiment that the photosensitivechip 33 is mounted lower than where the electronic components 32 mountedon the circuit board 35. For example, the connecting surface 350 of thecircuit board 35 is further shaped with a recess in the center, so thatthe photosensitive chip 33 is mounted in the recess of the circuit board35. And the thickness of the camera module in this mode is lower thanthe first embodiment since the lower body 312 is only required to behigher than the wires 34 rather than fully embedding the wires 34, andthe wires 34 is lower because of the sunken photosensitive chip 33.

It is worth to mention that second embodiment of the present inventionis illustrated in FIGS. 12-15, which is different from the firstembodiment that the electronic components 32A, the wires 34A and thephotosensitive chip 33A are embedded mainly by the lower body 312A. Inother words, the lower body 312A is higher than at least part of theelectronic components 32A to fully embed the electronic components 32Ainside at least part of the main body 31A.

In this embodiment, the filter 20A is mounted on top of the lower body312A and the optical assembly 10A is mounted on top of the containerbody 311A. With the electronic components 32A mainly embedded by thelower body 312A, the electronic components 32A are only stressed underthe filter 20A without bearing the weight and movement of the opticalassembly 10A, so that the electronic components 32A can have longerservice time. It can be understood that, in this embodiment of theinvention, the filter 20A is firmly bonded to the lower top surface3121A of the lower body 312A by the filter glue 220A; the opticalassembly 10A passes the lens glue 110A is firmly bonded to the highertop surface 3111A of the container body 311A to ensure the relativepositions of the filter 20A and the optical assembly 10A and thephotosensitive chip 33A respectively remain unchanged.

It is worth to mention that the height of the different electroniccomponents 32A in the camera module of the present invention may bedifferent, and in order to ensure that the height of the lower body 312Ais not too large, the electronic components 32A embedded in the lowerbody 312A is preferably less than 0.3 mm in height. In other words, inthe present invention, an electronic component having a height of lessthan 0.3 mm is referred to as a low component 321A in the electroniccomponent 32A, and an electronic component having a height of 0.3 mm ormore is referred to as a high component 322A in the electronic component32A. The low component 321A in the electronic components 32A is embeddedby the lower body 312A, and the high component 322A in the electroniccomponents 32A is embedded by the container body 311A. It will beappreciated that the low component 321A in the electronic components 32Aof the present invention may all be embedded by the lower body 312A(i.e., in the top view direction, all of the low components 321A aredisposed on the lower body 312A). Alternatively, the low component 321Ain the electronic component 32A may be partially embedded by the lowerbody 312A (ie, a part of the low component 321A is disposed within thelower body 312A in a top view direction).

More preferably, the periphery of the photosensitive chip 33A isprovided with the wires 34A or the electronic component 32A (ie, the lowcomponent 321A) embedded in the short body 312A, and the wires 34A andthe low components 321A are respectively located on different sides ofthe photosensitive chip 33A. That is, the wires 34A and the electroniccomponent 32A embedded in the short body 312A are not disposed in orderfrom the inside to the outside surrounding the photosensitive chip 33A.In other words, the low component 321A in the electronic component 32Amay be distributed according to the position of the wires 34A, and notall of the sides of the photosensitive chip 33A have the wires 34A, sothe low component 321A in the electronic component 32A may preferably beplaced on the photosensitive chip 33A one side or both sides without thewires 34A, so that the area of the wiring board can be reduced, the areaof the molding in the XY direction can be reduced, and the area of thecamera module can be reduced. It should be understood that since thewidth of the low component 321A in the electronic component 32A isusually about 0.25 mm, which is similar to the thickness of the lowerbody 312A, if the low component 321A in the electronic component 32A isdesired to be integrated into the short body 312A, and the low component321A in the electronic component 32A can only be disposed on the side ofthe photosensitive chip 33A where the wires are not provided. That is,the low component 321A in the electronic component 32A is not compatiblewith the arrangement position of the wires 34A, so that the portion ofthe short body 312A where the low component 321A is disposed cannot bewiring golded (i.e., the wires 34A cannot be provided).

It is worth to mention that the high component 322A of the electroniccomponent 32A is preferably disposed on the side of the photosensitivechip 33A having the wires 34A, so that the side of the container body311A on the photosensitive chip 33A without the wires 34A is need notcover the electrical component 32A. That is, the container body 311Adoes not have to be emptied from the electronic component 32A, andtherefore, the thickness of the container body 311A can be reduced, andthe thickness of the lower body 312A can be slightly increased.Preferably, the thickness of the container body 311A is smaller than thelower body 312A. The lower body 312A provides larger the lower topsurface 3121A to supporting the peripheral portion 22A of the filter 20Athan the first embodiment. The filter 20A is stably mounted on the lowerbody 312A.

The angle G between the higher side surface 3112A and the lower topsurface 3121A can be equal or greater than 100° in this embodiment. Inother words, the container body 311A is inclinedly extended from the topof the lower body 312A, so that the container body 311A is wellsupported and capable of supporting the optical assembly 10A withouteffecting the filter 20A. In other words, the angle G is formed whiledemolding in manufacturing. Also the lower side surface 3122A isinclinedly with the photosensitive chip 33A, which is similar as theangle G, so as to provide supporting force stably.

In this embodiment, the container body 311A is designed to support theoptical assembly 10A. The higher top surface 3111A of the container body311A is asymmetrical on four sides. In other words, four sides of thehigher top surface 3111A of the container body 311A are in differentthickness, so that the optical assembly 10A is protruded from less thickportion of the container body 311A, which benefits to improve fitnessbetween the camera module and the mounting casing 51 of the smartdevice. In other words, in order to fit the mounting casing 51 of thesmart device, the portion of the container body 311A near the mountingcasing 51 is in less thickness, so that the optical assembly 10A isslightly non-aligned with the molded photosensitive assembly 30A. Theoptical assembly 10A is biased to the mounting casing 51, for easilyimproving the fitness between the camera module and the mounting casing51 of the smart device. As shown in FIG. 6, since the container body311A has no needs to consider the electronic components 32A, the heightof the container body 311A can be reduced, so that the leg 111A has moremuch lower place to be supported on the higher top surface 3111Ameanwhile the thickness of the container body 311A can be furtherreduced to have nearer the optical assembly 10A with the mounting casing51A.

A manufacturing method of the camera module in above embodimentcomprises steps of:

I. connecting the photosensitive chip 33A with the wires 34A and theelectronic components 32A on the circuit board 3A5;

II. placing the connected circuit board 35A between an upper mould and alower mould; and

III. embedding the electronic components 32A on the circuit board 35A bythe main body 31A which comprises the container body 311A and the lowerbody 312A shorter than the container body 312A, and at least part of theelectronic components 32A is embedded under the lower body 312A.

Furthermore, the method further comprises steps of:

IV. mounting the filter 20A on the lower top surface 3121A of the lowerbody 312A; and

V. mounting the optical assembly 10A on the higher top surface 3111A ofthe container body 311A.

In one embodiment, the electronic components 32A comprises at least alow component 321A, wherein at least part of the low component 321A isembedded under the lower top surface 3121A of the lower body 312A, andeach of the low component 321A is shorter than 0.3 mm.

In one embodiment, the wires 34A is embedded by the lower body 312A,wherein the wires 34A and the low component 321A are all providedsurrounding the photosensitive chip 33A, and the wires 34A and the lowcomponent 321A are positioned on different sides of the photosensitivechip 33A.

In one embodiment according to the present invention, the thickness ofthe container body 311A is smaller than that of the lower body 312A atone side thereof, such that the optical assembly 10A is extended fromthe one side of the container body 311A and protruded beyond the moldedphotosensitive assembly 30A.

In one embodiment according to the present invention, the electroniccomponents 32A further comprises one or more higher electroniccomponents 322A, wherein the higher electronic components 322A areencapsulated in the container body 311A and the height of the higherelectronic component 322A is greater or equal to 0.3 mm.

In one embodiment according to the present invention, the higherelectronic components 322A and the wires 34A are located at the sameside of the photosensitive chip 33A.

In one embodiment according to the present invention, the angle formedbetween the higher inner side of the container body 311A and the lowertop surface 3121A of the lower body 312A is greater than or equal to100°.

It is worth mentioning that regarding to the structure of the TOMproduct, the optical leas 10A of the camera module can be eccentricallyprovided at the molded photosensitive assembly 30 (30A) for allowing atleast one side of the optical assembly 10A outwardly protrudes from themain body 31 (31A) of the molded photosensitive assembly 30 (30A),although the structure of the camera module is designed as the onesillustrated in the FIG. 6 or FIG. 15, in order to improve the engagementbetween the camera module and the outer casing of the smart device.However, the optical lens of the optical assembly 10A should beoptically aligned with the photosensitive chip 33 (33A) of the moldedphotosensitive assembly molded photosensitive assembly 30A (30).Therefore, the thickness of the container body 311A of the main body 31(31A) at the corresponding side is decreased. But, the container body311A with a decreasing thickness cause the lens glue 110A gets thinnerand once the lens glue 110A gets too much thinner, the adhesion strengthbetween the optical assembly 10 (10A) and the molded photosensitiveassembly 30 (30A) will not be strong enough, while the adhesion materialof the lens glue 110 (110A) may pollutes the filter 20 (20A).

In addition, an assembly cavity should be reserved between the higherside surface 3112 (3112A) of the container body 311 (311A) and thefilter 20 (20A), such that the adjusting range of the thickness of thecontainer body 311A (311A) gets very smaller. In other words, thethickness of the container body 311A (311A) is hard to decrease, whichis not beneficial to improve the engagement between the camera moduleand the outer casing of the smart device. In order to solve the aboveproblems, as illustrated in the FIGS. 16-21C, a third preferredembodiment according to the present invention is illustrated, whereindifferent from the first and second preferred embodiment, the containerbody 311B of the main body 31B of molded photosensitive assembly 30B hasa higher top surface 3111B and a lower top surface 3110B and the heightof the higher top surface 3111B is greater than that of the lower topsurface 3110B. In other words, the distance between the circuit board35B and the higher top surface 3111B is greater than the distancebetween the circuit board 35 and the lower top surface 3110B, such thatone portion of the optical assembly 10B is supported at the higher topsurface 3111B of the container body 311B and the other portion of theoptical assembly 10B supported at the lower top surface 3110B thereof.

In other words, the container body 311B of the molded photosensitiveassembly 30B is discontinuous (that is, the top surface of the containerbody 311B is discontinuous), that comprises the higher top surface 3111Band the lower top surface 3110B lower than the higher top surface 3111B,such that while a portion of the optical assembly 10B is attached to thehigher top surface 3111B of the container body 311B via the lens glue110B, the other portion of the optical assembly 10B is attached to thelower top surface 3110B thereof via the lens glue 110B.

In certain examples according to the present invention, the lens glue110B of the camera module may comprises an adhesion layer 1101B and aaddition adhesion layer 1102B, wherein the adhesion layer 1101B isapplied between the optical assembly 10B and the higher top surface3111B of the container body 311B for affixing the optical assembly 10Bto the higher top surface 3111B of the container body 311B via theadhesion layer 1101B. The adhesion layer 1101B is provided between thelower top surface 3110B of the container body 311B and the opticalassembly 10B for affixing the optical assembly 10B to the container body311B more securely.

Preferably, the lens glue 110 is applied at the container body 311 alongthe higher top surface 3111B thereof to form the adhesion layer 1101Bhaving a same with shape of the higher top surface 3111B of thecontainer body 311B, so as to maximize the bonding strength between theoptical assembly 10B and the molded photosensitive assembly 30B. Afterthe lens glue 110B is cured and forms the adhesion layer 1101B,additional lens glue 110B is applied between the lower top surface 3110Bof the container body 311B and the optical assembly 10B to form theaddition adhesion layer 1102B having a same shape with the lower topsurface 3110B of the container body 311B, such that the additionadhesion layer 1102B is not only able to strengthen the bonding betweenthe optical assembly 10B and the container body 311B, but also able toseal the space between the optical assembly 10B and the container body311B so as to prevent external contaminant polluting the opticalassembly 10B and/or the filter 20B.

It is appreciated that, since the lower top surface 3110B of thecontainer body 311B is lower than the higher top surface 3111B thereof,the gap formed between the lower top surface 3110B of the container body311B and the legs 111B of the optical assembly 10B is larger than thegap formed between the higher top surface 3111B of the container body311B and the legs 111B of the optical assembly 10B. In other words, theaddition adhesion layer 1102B applied between the lower top surface3110B of the container body 311B and the optical assembly 10B is thickerthan that applied between the higher top surface 3111B of the containerbody 311B and the optical assembly 10B. In this way, the bonding betweenthe optical assembly 10B and the molded photosensitive assembly 30B canbe reinforced while the thickness of the container body 311B at thelower top surface 3110B can be decreased for improving the engagingbetween the camera mould and the outer casing of the smart device.

More specifically, as shown in the FIG. 17, the higher top surface 3111Bof the container body 311B according to the preferred embodiment of thepresent invention has a U shape, wherein the lower top surface 3110B ofthe container body 311B has a linear shape and extends from a higherouter side surface 3113B of container body 311B to other higher outerside surface 3113B thereof (that is, the length of the lower top surface3110B of the container body 311B is equal to the distance between thetwo higher outer side surfaces 3113B) so as to form a U-shaped slot inthe main body 31B. In other words, the higher top surface 3111B of thecontainer body 311B is corresponding with three side edges of theoptical assembly 10B and the lower top surface 3110B of the containerbody 311B is corresponding to one side edge of the optical assembly 10B,such that three sides of the optical assembly 10B is supported on thehigher top surface 3111B of the container body 311B while one side ofthe optical assembly 10B is supported on the lower top surface 3110B ofthe container body 311B. It is appreciated that the addition adhesionlayer 1102B formed between the lower top surface 3121B of the lower body312B is thicker than the adhesion layer 1101B formed at the higher topsurface 3111B of the container body 311B for maintaining the opticalassembly 10B parallel with the filter 20B.

Preferably, the adhesion layer 1101B of the lens glue 110B may have aU-shape matching with the higher top surface 3111B of the container body311B. The addition adhesion layer 1102B of the lens glue 110B may have alinear shape matching with the lower top surface 3110B of the containerbody 311B. In this way, the adhesion layer 1101B and the additionadhesion layer 1102B are incorporated with each other to form the lensglue 110 with an open-mouth shape, so as to seal the space between theoptical assembly 10B and the molded photosensitive assembly 30B forpreventing external contaminant polluting the optical assembly 10Band/or the filter 20B.

It is worth mentioning that in certain examples according to the presentinvention, the electronic components 321B, because of its larger height,is suitable to be encapsulated in the main body 31B and located belowthe higher top surface 3111B of the container body 311B. In other words,the electronic components 321B are suitable to arrange at three sides ofthe photosensitive chip 33B and corresponding to the higher top surface3111B of the container body 311B.

Further, the lower top surface 3110B of the container body 311B isaligned with the lower top surface 3121B of the lower body 312B. Inother words, the container body 311 has a height at the lower topsurface 3110B thereof equal to the height of the lower body 312B. Inthis way, there is no need to reserve an avoiding space for filter 20Bat the lower top surface 3110B of the container body 311B and thethickness of the container body 311 at the lower top surface 3110Bthereof can be decreased, so that the optical assembly 10B is moreoutwardly protruded from the lower top surface 3110B of the containerbody container body 311, for improving the engagement between the cameramodule and the outer casing of the smart device.

As shown in the FIG. 16, the outer casing 51B of the smart device hasrounded corners, and the optical assembly 10 is protruded outwardly fromthe lower top surface 3110B of the container body 311B, such that thelens glue 110B can be more adjacent to the outer casing 51B so as toincrease a screen-to-body ratio of the smart device.

As shown in the FIGS. 16-18, the container body 311B has a U-shapedstructure and the inner side of the lower body 312B extending to thecontainer body 311B has a square shape to form the U-shaped slot in themain body 31B. In other words, the container body 311 has a notch formedat the lower top surface 3110B of the container body 311B, such thatwhen the optical assembly 10B is attached to the lower top surface 3110Bof the container body 311B via the lens glue 110B, a gas-emittingchannel is formed between the optical assembly 10B and the lower topsurface 3110B of the container body 311B for enabling the gas within theoptical assembly 10B and the filter 20B being discharged to the externalalong the gas-emitting channel when the lens glue 110 is cured, so as toprevent the optical assembly 10B and the filter 20B being damaged by theair expansion therebetween. It is appreciated that similar to the firstand second embodiments, the filter 20B is also supported on the lowertop surface 3121B of the lower body 312B.

Referring to FIG. 19 of the drawings, the container body 311B isembodied in another shape. More specially, the lower top surface 3110Bof the container body 311B is extended from an higher side surface 3112Bto the other higher side surface 3112B thereof (that is, the length ofthe lower top surface 3110B of the container body 311B is equal to thedistance between the two higher side surfaces 3112B), such that thecontainer body 311B has a higher top surface 3111B in layer size forsupporting the optical assembly 10B more stably thereon.

The manufacturing method of the camera module is illustrated in FIGS.20-21C. The method comprises steps of:

I. connecting the photosensitive chip 33B with the wires 34B and theelectronic components 32B on the circuit board 35B;

II. placing the connected circuit board 35B between an upper mould 41Band a lower mould 42B;

III. embedding the electronic components 32B on the circuit board 35B inthe main body 31B which comprises the container body 311B and the lowerbody 312B to form the molded photosensitive assembly 30B;

IV. mounting the filter 20B on the lower top surface 3121B of the lowerbody 312B; and

V. biased mounting the optical assembly 10B on the higher top surface3111B of the container body 311, so that the optical assembly 10B isclosed to at least one side of a mounting casing 51.

Furthermore, the step V further comprises steps of:

V.1 fixing the optical assembly 10B with the higher top surface 3111B ofthe container body 311B;

V.2 firming the optical assembly 10B on the lower top surface 3110B ofthe container body 311B, wherein the lower top surface 3110B is shorterthan the higher top surface 3111B.

In one embodiment, the higher top surface 3111B of the container body311B in step III is U-shaped, so that the optical assembly is supportedon the higher top surface 3111B of the container body 311B on threesides, and on lower top surface 3110B of the container body 311B on oneside.

In one embodiment, lower top surface 3110B of the container body 311B isextended from one of the higher side surface 3112B of the container body311B to the other higher side surface 3112B.

It is worth to mention that, in step V.1, applying the lens glue 110B onthe higher top surface 3111B of the container body 311B, to form aadhesion layer 1101B between the higher top surface 3111B of thecontainer body 311B and the optical assembly 10B.

Furthermore, the step V.2 further comprises steps of:

V.21 placing the optical assembly 10B and the molded photosensitiveassembly 30B upside down to position the optical assembly 10B under themolded photosensitive assembly 30B; and

V.22 applying the lens glue 110B between the leg 111B of the opticalassembly 10B and the lower top surface 3110B of the container body 311B,to form an addition adhesion layer 1102B

With the optical assembly 10B and the molded photosensitive assembly 30Bare upside down, the lens glue 110B has no chance to flow into thein-light surface 211B of the filtering portion 21B so that the filter20B is maintained clear and well supported.

In one embodiment, the adhesion layer is U-shaped, and the additionfixing layer 1102B is straight line shaped.

In one embodiment, the adhesion layer is L-shaped, and the additionfixing layer 1102B is L-shaped.

In particular, in an embodiment of the invention, the angle between thehigh side surface 3112B of the container body 311B and the lower topsurface 3121B of the lower body 312B is between 95° and 100°.

It is worth mentioning that when the higher top surface 3111B of thecontainer body 311B is U-shaped, the lower top surface 3110B of thecontainer body 311B will be linear and located one side of the main body31B, such that the optical assembly 10B of the camera module canprotrude outward from the side where the lower top surface 3110B tooutside of the molded photosensitive member 30B, contributing theoptical assembly 10B extremely close to the mounting casing of the smartdevice on the side of the lower top surface 3110B, such that the cameramodule is adapted to be mounted to a non-corner region of the mountingcasing to be unilaterally adjacent to the mounting casing. However, whenthe camera module is mounted on a corner area of the mounting casing ofthe smart device, the optical assembly 10B cannot be on both sides atthe same time close to the mounting casing because the optical assembly10B is only on one side of the lower top surface 3110B of the main body31B, resulting in insufficient fitness between the camera module and themounting casing.

Therefore, in order to solve the above problems, the present inventionfurther provides another alternative embodiment of the camera module, asshown in FIG. 22 and FIG. 23, wherein the higher top surface 3111B ofthe container body 311B is L-shaped, and the lower top surface 3110B ofthe container body 311B is also L-shaped such that the lower top surface3110B is located on two adjacent sides of the main body 31B. In otherwords, in the alternative embodiment of the present invention, thehigher top surface 3111B of the container body 311B of the moldedphotosensitive member 30B of the camera module is L-shaped, such thatthe optical assembly 10B is supported on the adjacent two sides ofhigher top surface 3111B of the container body 311B, and on two adjacentsides of the lower top surface 3110B of the container body 311B. Thus,the optical assembly 10B of the camera module can protrude from the twosides of the lower top surface 3110B on the molded photosensitive member30B, which benefits the optical assembly 10B extreme proximity to themounting casing of the smart device on the two sides of the lower topsurface 3110B, such that the camera module is adapted to be mounted to acorner region of the mounting casing, such that the optical assembly 10Bis bilaterally adjacent to the mounting casing maximizes the screenradio of the smart device.

Preferably, the adhesion layer 1101B of the lens glue 110B may beL-shaped to match the higher top surface 3111B of the container body311B. The addition adhesion layer 1102B of the lens glue 110B may alsobe L-shaped to match the lower top surface 3112B of the container body312B. The adhesion layer 1101B and the addition adhesion layer 1102B arecombined to form the lens glue 110B having a square-shaped structure toseal a space between the optical assembly 10B and the moldedphotosensitive member 30B to prevent external dust from entering andcontaminating the optical assembly 10B and/or the filter 20B.

It is worth to mention that, in some embodiments of the presentinvention, the electronic components 321B are adapted to be embedded bythe container body 311B of the main body 31B due to a large height, andis located under the higher top surface 3111B of the container body311B. In other words, the electronic components 321B are adapted to bedisposed on both sides of the photosensitive chip 33B, and theelectronic components 321B are corresponded to the upper top surface3111B of the container body 311B.

One skilled in the art will understand that the embodiment of thepresent invention as shown in the drawings and described above isexemplary only and not intended to be limiting.

It will thus be seen that the objects of the present invention have beenfully and effectively accomplished. The embodiments have been shown anddescribed for the purposes of illustrating the functional and structuralprinciples of the present invention and is subject to change withoutdeparture from such principles. Therefore, this invention includes allmodifications encompassed within the spirit and scope of the followingclaims.

What is claimed is:
 1. A camera module, comprising: an optical assembly;a filter; and a molded photosensitive assembly mounted with said opticalassembly and said filter, wherein said molded photosensitive assemblycomprises a main body, a plurality of electronic components, aphotosensitive chip, and a circuit board electrically connected withsaid plurality of electronic components and said photosensitive chip,wherein said circuit board is electrically connected to saidphotosensitive chip, wherein said main body, which is integrally moldedon said circuit board to integrally embed said plurality of electroniccomponents, comprises a container body supporting said optical assemblythereon and a lower body extended from an inner side of said containerbody to support said filter.
 2. The camera module, as recited in claim1, wherein said lower body has a lower top surface, wherein at least oneof said plurality of electronic components is at least partiallyembedded in said lower body under said lower top surface.
 3. The cameramodule, as recited in claim 1, wherein said lower body has a lower topsurface, wherein said lower top surface is higher than at least one ofsaid plurality of electronic components to allow said lower body to atleast partially embed said at least one of said plurality of electroniccomponents.
 4. The camera module, as recited in claim 2, wherein said atleast one of said plurality of electronic components is integrallyembedded in said lower body under said lower top surface.
 5. The cameramodule, as recited in claim 1, wherein said lower body has a lower topsurface, wherein said plurality of electronic components comprises atleast one low component less than 0.3 mm in height and at least one highcomponent not less than 0.3 mm in height, wherein said at least one lowcomponent is at least partially embedded in said lower body under saidlower top surface, wherein said at least one high component isintegrally embedded in said container body.
 6. The camera module, asrecited in claim 5, wherein all said at least one low component isintegrally embedded in said lower body under said lower top surface. 7.The camera module, as recited in claim 5, further comprising a pluralityof wires electrically connecting said circuit board to saidphotosensitive chip, wherein said plurality of wires and said at leastone low component are respectively located on different sides of saidphotosensitive chip.
 8. The camera module, as recited in claim 5,wherein said plurality of wires and said least one high component arelocated at least one same side of said photosensitive chip.
 9. Thecamera module, as recited in claim 5, wherein said container body has ahigher top surface, wherein an angle between said higher top surface andsaid lower top surface is equal or greater than 100°.
 10. The cameramodule, as recited in claim 5, wherein said main body is integrallymolded on said circuit and said photosensitive chip.
 11. A moldedphotosensitive assembly for a camera module comprising an opticalassembly and a filter, wherein said molded photosensitive assemblycomprises: a main body; a plurality of electronic components; aphotosensitive chip, and a circuit board electrically connected withsaid plurality of electronic components and said photosensitive chip,wherein said circuit board is electrically connected to saidphotosensitive chip, wherein said main body, which is integrally moldedon said circuit board to integrally embed said plurality of electroniccomponents, comprises a container body for supporting the opticalassembly and a lower body extended from an inner side of said containerbody for supporting the filter.
 12. The molded photosensitive assembly,as recited in claim 11, wherein said lower body has a lower top surface,wherein at least one of said plurality of electronic components isintegrally embedded in said lower body under said lower top surface. 13.The molded photosensitive assembly, as recited in claim 11, wherein saidlower body has a lower top surface, wherein said lower top surface ishigher than at least one of said plurality of electronic components toallow said lower body to at least partially embed said at least one ofsaid plurality of electronic components.
 14. The molded photosensitiveassembly, as recited in claim 11, wherein said lower body has a lowertop surface, wherein said container body has a higher top surface,wherein said plurality of electronic components comprises at least onelow component less than 0.3 mm in height and at least one high componentnot less than 0.3 mm in height, wherein said at least one low componentis at least partially embedded in said lower body under said lower topsurface, wherein said at least one high component is integrally embeddedin said container body under said higher top surface.
 15. The moldedphotosensitive assembly, as recited in claim 14, further comprising aplurality of wires electrically connecting said circuit board to saidphotosensitive chip, wherein said plurality of wires and said at leastone low component are respectively located on different sides of saidphotosensitive chip.
 16. The molded photosensitive assembly, as recitedin claim 14, wherein said container body has a higher top surface,wherein an angle between said higher top surface and said lower topsurface is equal or greater than 100°.
 17. The molded photosensitiveassembly, as recited in claim 15, wherein said main body is integrallymolded on said circuit and said photosensitive chip, wherein saidplurality of wires are integrally embedded in said main body.
 18. Amanufacturing method of a camera module, comprising said steps of: (a)integrally molding a main body on a circuit board to form a moldedphotosensitive assembly, wherein said circuit board is electricallyconnected to a photosensitive chip and a plurality of electroniccomponents, wherein said main body comprises a container body has ahigher top surface and a lower body extended from an inner side of saidcontainer body, wherein at least one of said plurality of electroniccomponents is at least partially embedded in said lower body under alower top surface of said lower body; (b) mounting a filter on saidlower top surface; and (c) mounting an optical assembly on said moldedphotosensitive assembly.
 19. The method, as recited in claim 18, whereinsaid plurality of electronic components comprises at least one lowcomponent less than 0.3 mm in height and at least one high component notless than 0.3 mm in height, wherein said at least one low component isat least partially embedded in said lower body under said lower topsurface, wherein said at least one high component is integrally embeddedin said container body under said higher top surface.
 20. The method, asrecited in claim 19, further comprising a plurality of wireselectrically connecting said circuit board to said photosensitive chip,wherein said plurality of wires and said at least one low component arerespectively located on different sides of said photosensitive chip.